Copper (Cu) Series

Product Classification:

Copper (Cu)

Keyword:

AlSiC IGBT substrate AlSiC heat sink

Product Features

Oxygen-free copper is pure copper that does not contain oxygen or any deoxidizer residue, without hydrogen embrittlement. It has a density of 8.9(g/cm3), a melting point of 1083°C, a softening temperature of 150°C, a thermal conductivity of 391W/(M.K), and a thermal expansion system of 17.7(10-6/K). Oxygen-free copper has good thermal conductivity, good processing performance, welding performance, corrosion resistance and low temperature performance. Widely used in the electronics industry. The surface of the product can be nickel-plated, gold-plated, silver-plated and other treatments.
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Product Details

Oxygen-free copper is pure copper that does not contain oxygen or any deoxidizer residue, without hydrogen embrittlement. It has a density of 8.9(g/cm3), a melting point of 1083°C, a softening temperature of 150°C, a thermal conductivity of 391W/(M.K), and a thermal expansion system of 17.7(10-6/K). Oxygen-free copper has good thermal conductivity, good processing performance, welding performance, corrosion resistance and low temperature performance. Widely used in the electronics industry. The surface of the product can be nickel-plated, gold-plated, silver-plated and other treatments.

Melting Point softening temperature Density (g/cm3) Thermal conductivity W/(M.K) Coefficient of thermal expansion (10-6/K)
1083 ℃ 150℃ 8.93 391 17.7

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