Copper-Molybdenum-Copper (CMC) Series

Copper-molybdenum-copper is a composite material with a similar "sandwich" structure, the core material is metal Mo, and the two sides are covered with pure copper. Its performance such as expansion coefficient is designable, and it also has the characteristics of high strength, high thermal conductivity and can be punched. Therefore, it is often used in some of the more important occasions, as a heat sink, lead frame and multi-layer printed circuit board (PCB) low expansion and thermal conduction channel.
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