Products

Heat sink

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Heat sink

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Heat sink

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Heat Sink

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Heat Sink

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Heat Sink

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Heat Sink

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Heat sink

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.
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