Products

Heat sink

AlSiC has great potential in military microelectronics and civil microelectronics because of its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Heat sink

AlSiC has great potential in military microelectronics and civilian microelectronics due to its low thermal expansion, high thermal conductivity, lightweight and high stiffness.

Heat sink

AlSiC has great potential in military microelectronics and civil microelectronics because of its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Gold-plated heat sink block

AlSiC has great potential in military microelectronics and civil microelectronics because of its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Gold-plated heat sink

AlSiC has great potential in military microelectronics and civil microelectronics because of its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Gold-plated heat sink

AlSiC has great potential in military microelectronics and civil microelectronics because of its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Slats heat sink gold-plated

AlSiC has great potential in military microelectronics and civil microelectronics because of its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Heat sink

AlSiC has great potential in military microelectronics and civil microelectronics because of its low thermal expansion, high thermal conductivity, light weight and high stiffness.
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