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AlSiC has great potential in military microelectronics and civil microelectronics because of its low thermal expansion, high thermal conductivity, light weight and high stiffness.
IGBT module, also known as insulated gate bipolar transistor, is widely used in high-speed rail, subway, new energy vehicles, wind power and other fields. Using AlSiC as the IGBT power device heat dissipation substrate, instead of oxygen-free copper, aluminum base plate, can greatly improve the reliability of power devices.
IGBT module, also known as insulated gate bipolar transistor, is widely used in high-speed rail, subway, new energy vehicles, wind power and other fields. Using AlSiC as the IGBT power device heat dissipation substrate, instead of oxygen-free copper, aluminum base plate, can greatly improve the reliability of power devices.
IGBT module, also known as insulated gate bipolar transistor, is widely used in high-speed rail, subway, new energy vehicles, wind power and other fields. Using AlSiC as the IGBT power device heat dissipation substrate, instead of oxygen-free copper, aluminum base plate, can greatly improve the reliability of power devices.
IGBT module, also known as insulated gate bipolar transistor, is widely used in high-speed rail, subway, new energy vehicles, wind power and other fields. Using AlSiC as the IGBT power device heat dissipation substrate, instead of oxygen-free copper, aluminum base plate, can greatly improve the reliability of power devices.
Aluminum silicon carbide as a hermetic shell package, with good thermal conductivity, can significantly reduce the weight of the package, while reducing the cost. In the fields of power electronics, power electronics, power microwave, photoelectric conversion, communication base station signal amplifier, hybrid circuit, etc., it has unparalleled performance advantages compared with traditional metal, ceramic and other packaging materials.
Aluminum silicon carbide as a hermetic shell package, with good thermal conductivity, can significantly reduce the weight of the package, while reducing the cost. In the fields of power electronics, power electronics, power microwave, photoelectric conversion, communication base station signal amplifier, hybrid circuit, etc., it has unparalleled performance advantages compared with traditional metal, ceramic and other packaging materials.
AlSiC can be used for anti-thermal deformation structural parts, wear-resistant structural parts, lightweight aerospace structural parts.
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