Tungsten Copper (W-Cu) Series
Product Classification:
Tungsten copper (W-Cu)
Keyword:
AlSiC IGBT substrate AlSiC heat sink
Product Features
Product Details
Tungsten copper material combines the advantages of metal tungsten and copper, of which tungsten has high melting point (tungsten melting point is 3410 ℃, copper melting point is 1080 ℃) and high density (tungsten density is 19.25g/cm3, copper density is 8.92g/cm3); Copper has excellent electrical and thermal conductivity, tungsten copper alloy (the general composition range is WCu7 ~ WCu50) has uniform microstructure, high temperature resistance, high strength, arc ablation resistance, and high density; moderate electrical and thermal conductivity, and is widely used in military high-temperature resistant materials, high-voltage switch electrical alloys, Electro-machining electrodes, microelectronic materials, as parts and components are widely used in aerospace, aviation, electronics, electric power, metallurgy, machinery, sports equipment and other industries.
| Performance | Density g/cm3 | Thermal expansion coefficient 10-6/℃ | Thermal conductivityW/(m · k) | Heat capacityJ/(kg·℃) | modulus of elasticityGPa | Poisson density | Melting point ℃ | Strength MPa |
| Tungsten | 19. 25 | 4. 5 | 174 | 136 | 411 | 0. 28 | 3410 | 550 |
| Copper | 8. 92 | 16. 6 | 403 | 385 | 145 | 0. 34 | 1083 | 120 |
military high temperature resistant material
Tungsten copper alloy is used as nozzle, gas rudder, air rudder and nose cone of missile and rocket engine in aerospace. Its main requirements are high temperature resistance (3000K ~ 5000K) and high temperature resistant air flow scouring ability. It mainly uses sweating refrigeration effect (melting point of copper is 1083 ℃) formed by volatilization of copper at high temperature to reduce the surface temperature of tungsten copper and ensure its use under extreme conditions of high temperature.
| Brand | Copper Cu | Tungsten W | Total Impurities | Density g/cm3(20 ℃) | Conductivity%IACS | melting temperature (℃) | Bending strengthMpa | Hardness |
| CuW70 | 28-32 | Allowance | < 0.5 | 13.8-14 | ≥ 42 | ≥ 700 | ≥ 667 | ≥ 184 |
high temperature tungsten copper performance
| Brand | Copper content | Relative density of tungsten skeleton | Material densityg/cm3 | relative density | Tensile strength MPa | Fracture toughness MPa m | |
| Room temperature | 800 ℃ | ||||||
| WCu10 | 8~12% | 77~82% | 16.5~17.5 | ≥97 | ≥ 300 | ≥ 150 | 15~18 |
| WCu7 | 6~9% | 82~86% | 17~18 | ≥97 | ≥ 300 | ≥ 150 | 13~15 |
| Brand | Components | Performance | ||||
| Density | CTE (ppm/k) | Thermal conductivity (W/m.k) | ||||
| Ingredients | Content | Mass density (g/cm³) | Relative Density (%T.D.) | |||
| W90Cu | In Cu | 90±1 balance | 17.0 | ≥99 | 5.6-6.5 | 190-200 |
| W85Cu | In Cu | 85±1 balance | 16.3 | ≥99 | 6.3-7.0 | 200-210 |
| W80Cu | In Cu | 80±1 balance | 15.4 | ≥99 | 7.6-9.1 | 220-230 |
| W50Cu | In Cu | 50±1 balance | 12.3 | ≥99 | 12.3-12.8 | 230-240 |
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