Molybdenum Copper (Mo-Cu) Series

Product Classification:

Molybdenum copper (Mo-Cu)

Keyword:

AlSiC IGBT substrate AlSiC heat sink

Product Features

Molybdenum-copper alloys are used as heat sink materials due to their high thermal conductivity. The properties of these two alloys are close, and the density of molybdenum-copper alloys is less than that of tungsten-copper alloys. The preparation of molybdenum copper alloy is mainly by melting and leaching method, using high quality molybdenum powder and oxygen-free copper powder, and applying isostatic pressing (high temperature sintering-copper infiltration), with fine organization, good arc breaking performance, good electrical conductivity, good thermal conductivity and small thermal expansion. Japan's Tokyo Tungsten Company to obtain the molybdenum copper alloy production patent, the use of chemical activation sintering method.
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Product Details

Molybdenum-copper alloys are used as heat sink materials due to their high thermal conductivity. The properties of these two alloys are close, and the density of molybdenum-copper alloys is less than that of tungsten-copper alloys. The preparation of molybdenum copper alloy is mainly by melting and leaching method, using high quality molybdenum powder and oxygen-free copper powder, and applying isostatic pressing (high temperature sintering-copper infiltration), with fine organization, good arc breaking performance, good electrical conductivity, good thermal conductivity and small thermal expansion. Japan's Tokyo Tungsten Company to obtain the molybdenum copper alloy production patent, the use of chemical activation sintering method.

Alloy grade Cu Mo Total amount of impurity elements
MoCu10 10 /-2 Allowance ≤0.1
MoCu15 15 /-3 Allowance ≤0.1
MoCu20 20 /-3 Allowance ≤0.1
MoCu25 25 /-3 Allowance ≤0.1
MoCu40 40 /-5 Allowance ≤0.1

 

Alloy grade MoCu10 MoCu15 MoCu20 MoCu25 MoCu40
thermal conductivity ≥ 150 ≥ 160 ≥ 170 ≥180  
thermal expansion rate 5.6 /-1.5 6.7 /-1.5 7.4 /-1.5 7.9 /-2 8.0 /-3
Alloy grade MoCu10 MoCu15 MoCu20 MoCu25 MoCu40
Density ≥ 9.91 ≥ 9.83 ≥ 9.75 ≥ 9.70 ≥ 9.3

 

Brand Components Performance
Density CTE(ppm/k) Thermal conductivity (W/m.k)
Ingredients Content Mass density (g/cm³) Relative Density (%T.D.)
Mo70Cu Mo Chi Minh City 70±1 balance 9.7 ≥99 7.6-7.8 190-200
Mo60Cu Mo Chi Minh City 60±1 balance 9.6 ≥99 8.3-8.5 200-220
Mo50Cu Mo Chi Minh City 50±1 balance 9.5 ≥99 9.7-9.9 220-250

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