Bottom case

Product Classification:

AlSiC Microwave Housing

Keyword:

AlSiC IGBT substrate AlSiC heat sink

Product Features

Aluminum silicon carbide as a hermetic shell package, with good thermal conductivity, can significantly reduce the weight of the package, while reducing the cost. In the fields of power electronics, power electronics, power microwave, photoelectric conversion, communication base station signal amplifier, hybrid circuit, etc., it has unparalleled performance advantages compared with traditional metal, ceramic and other packaging materials.
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Product Details

Aluminum silicon carbide as a hermetic shell package, with good thermal conductivity, can significantly reduce the weight of the package, while reducing the cost. In the fields of power electronics, power electronics, power microwave, photoelectric conversion, communication base station signal amplifier, hybrid circuit, etc., it has unparalleled performance advantages compared with traditional metal, ceramic and other packaging materials.

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