Heat sink block
AlSiC Heat Sink
AlSiC IGBT substrate AlSiC heat sink
AlSiCWith its low thermal expansion, high thermal conductivity and high stiffness and other characteristics of lightweightmilitary microelectronicsandcivilian microelectronicsApplication potential is huge.
military microelectronics package heat dissipation:
AlSiCCan be applied to: flip-chip cover plate.AlSiCIdeal material for this application,Because of itsCTEAble to work with dielectric substrates, ceramic solder ball arrays(BGA)Low temperature sintered ceramics(LTCC)MATCHING MATERIAL AND PRINTED CIRCUIT BOARD,It also has high thermal conductivity values. In addition,AlSiCThe high strength and hardness also provide protection for the integrated circuit device during assembly. The low density of such materials may also improve the reliability of the device when subjected to shock or vibration.
civil microelectronics package heat dissipation:
AlSiCCan be applied to: electronic chip (application specific integrated circuit) and power module heat sink; Microprocessor cover and radiator; Computer chip(CPU)and server chips (MPU) of the cover plate or the bottom heat sink.