Heat sink

Product Classification:

AlSiC Heat Sink

Keyword:

AlSiC IGBT substrate AlSiC heat sink


Product Features

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Product Details


AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.

For military microelectronics packaging---flip-chip bonding cover plate. 

AlSiC is ideal for this application because its CTE matches dielectric substrates, Ceramic Ball Grid Array (BGA), Low Temperature Co-fired Ceramic (LTCC) materials, and printed circuit boards, while also has high thermal conductivity. In addition, AlSiC's high strength and hardness also provide protection for integrated circuit devices during assembly. The low density of such materials also improve the reliability of devices under shock or vibration.

For civil microelectronics packaging---electronic chips (application-specific integrated circuits) and heat sink of power modules; heat sink of microprocessor cover plate; heat sink of cover or bottom plate for computer chips (CPU) and server chips (MPU).

photoelectric packaging
All packages are moulded and no additional machining is required for critical optical alignment parts. 
AlSiC can adjust the value of CTE to ensure alignment of sensitive optics in operation, while also eliminating residual stresses that may be introduced during welding or brazing assembly.

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