AlSiC Heat Sink
AlSiC IGBT substrate AlSiC heat sink
AlSiC has great potential in military microelectronics and civilian microelectronics due to its low thermal expansion, high thermal conductivity, lightweight and high stiffness.
AlSiC can be applied to: heat sinks for electronic chips (application specific integrated circuits) and power modules; microprocessor covers and heat sinks; covers or bottom heat sinks for computer chips (CPU) and server chips (MPU)
AlSiC can be applied to: flip chip welding cover plate. AlSiC is an ideal material for this application because of its CTE ability to match dielectric substrates, ceramic ball arrays (BGA), low-temperature fired ceramic (LTCC) materials, and printed circuit boards, as well as high thermal conductivity values. In addition, AlSiC's high strength and hardness provide protection for integrated circuit devices during assembly. The low density of these materials also improves device reliability when exposed to shock or vibration.