Aluminum diamond/copper diamond (Al-Dia/Cu-Dia) series

Product Classification:

Aluminum diamond/copper diamond (Al-Dia/Cu-Dia)

Keyword:

AlSiC IGBT substrate AlSiC heat sink


Product Features

Diamond copper is a composite material of diamond powder and copper alloy. Using high-quality synthetic diamond powder, which has a thermal conductivity of about 1000 W/M.K, and a very low thermal expansion coefficient, under the appropriate process, diamond particles and copper alloy to reach a metallurgical bonding interface, the diamond copper composite material has excellent thermal conductivity and appropriate thermal expansion coefficient.

Product Details


Diamond copper is a composite material of diamond powder and copper alloy. Using high-quality synthetic diamond powder, which has a thermal conductivity of about 1000 W/M.K, and a very low thermal expansion coefficient, under the appropriate process, diamond particles and copper alloy to reach a metallurgical bonding interface, the diamond copper composite material has excellent thermal conductivity and appropriate thermal expansion coefficient.
Diamond aluminum, similar to diamond copper, has a lower density, but slightly inferior thermal conductivity to diamond copper.

成分COMPOSITION Density DENSITY BENDING STRENGTH of bending strength 热导率THERMAL CONDUCTIVITY   CTE at 25 °C
  (g/cm³)   MPa   W/M-1.K-1 (10-6/K-1)
Diamond/Al-A   3.09 450 450 9.0
Diamond/Al-B     3.15 400 400 6.6
Diamond/CU-A 5.0 550 550 6.0
Diamond/CU-B 4.5 600 600 4.0

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