Aluminum silicon (AlSi) series

Product Classification:

Aluminum silicon (AlSi)

Keyword:

AlSiC IGBT substrate AlSiC heat sink


Product Features

Silicon aluminum (AISi) material is also a metal ceramic composite material, which makes full use of the properties of aluminum and metal silicon, and is mainly used for aerospace packaging tube shell. Although its thermal conductivity is slightly inferior to that of aluminum silicon carbide, its hardness is lower and its machining performance is better than that of aluminum silicon carbide. The silicon content is 27%,42%,50%,60% and 70%. It is mainly used in electronic packaging and plays an excellent role in the packaging of microwave power devices, integrated power modules, T/R modules and other electronic power devices. The use of high-silicon aluminum alloy as the base, shell, box, and cover of the electronic packaging material has high matching, can provide better heat dissipation, can greatly extend the service life of the packaged high-power module, and increase reliability. The material has the characteristics of light weight, high rigidity, high thermal conductivity, low thermal expansion, good mechanical processing and surface coating performance and welding performance, and the material has the characteristics of good compactness, high temperature resistance and corrosion resistance.

Product Details


Silicon aluminum (AISi) material is also a metal ceramic composite material, which makes full use of the properties of aluminum and metal silicon, and is mainly used for aerospace packaging tube shell. Although its thermal conductivity is slightly inferior to that of aluminum silicon carbide, its hardness is lower and its machining performance is better than that of aluminum silicon carbide. The silicon content is 27%,42%,50%,60% and 70%. It is mainly used in electronic packaging and plays an excellent role in the packaging of microwave power devices, integrated power modules, T/R modules and other electronic power devices. The use of high-silicon aluminum alloy as the base, shell, box, and cover of the electronic packaging material has high matching, can provide better heat dissipation, can greatly extend the service life of the packaged high-power module, and increase reliability. The material has the characteristics of light weight, high rigidity, high thermal conductivity, low thermal expansion, good mechanical processing and surface coating performance and welding performance, and the material has the characteristics of good compactness, high temperature resistance and corrosion resistance.

Alloy composition COMPOSITION CTE at 25 °C Density DENSITY 热导率THERMAL CONDUCTIVITY   BENDING STRENGTH of bending strength Tensile strength TENSILE STRENGTH elastic modulus ELASTIC MODULUS
  10^(-6)/k (g/cm³)   W/mk MPa   GPa   GPa  
Al-27Si   16.0 2.6 177 210 183 92
Al-47Si   12.8 2.55 160 213 155 107
Al-50Si   11.0 2.50 149 172 125 121
Al-60Si   9.0 2.45 129 140 134 124
Al-70Si   6.8 2.40 120 143 100 129
Al-80Si   4.8 2.38 110 148 96 136

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