Copper/Molybdenum-Copper/Copper (CPC) Series
Product Classification:
Copper/molybdenum-copper/copper (CPC)
Keyword:
AlSiC IGBT substrate AlSiC heat sink
Product Features
Product Details
Similar to copper-molybdenum-copper (CMC), copper/molybdenum-copper/copper (CPC) material is also a sandwich structure. It is wrapped by two sub-layers-copper (Cu) and a core layer-molybdenum-copper alloy (MoCu). It has different thermal expansion coefficients in X region and Y region. Compared with tungsten-copper, molybdenum-copper and copper/molybdenum/copper materials, copper-molybdenum copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price. It was invented by the Japanese at the beginning of this century, should be 3G high-power devices, and is now widely used in high-power chips, device heat dissipation.
The CPC layer thickness ratios can likewise be adjusted arbitrarily to achieve different coefficients of thermal expansion. The X and Y direction expansion coefficients of CMC are the same, but the X and Y direction expansion coefficients of CPC are adjustable, which is due to the adjustable deformation of molybdenum particles in the core material molybdenum copper. CPC can be stamped.
| Brand | Degreaser (g/cm³) | Coefficient of thermal expansion (10-6/℃) | Thermal conductivity (W/m.k) |
| CPC141 | 9.5 | 7.3 | 211 |
| CPC111 | 9.2 | 9.5 | 260 |
| CPC232 | 9.3 | 7.5 | 250 |
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