Copper-Molybdenum-Copper (CMC) Series
Product Classification:
Copper-molybdenum-copper (CMC)
Keyword:
AlSiC IGBT substrate AlSiC heat sink
Product Features
Product Details
Copper-molybdenum-copper is a composite material with a similar "sandwich" structure, the core material is metal Mo, and the two sides are covered with pure copper. Its performance such as expansion coefficient is designable, and it also has the characteristics of high strength, high thermal conductivity and can be punched. Therefore, it is often used in some of the more important occasions, as a heat sink, lead frame and multi-layer printed circuit board (PCB) low expansion and thermal conduction channel.
Product features:
Can provide large area plate
☆ Can be made into parts, reduce costs
☆ meet with a firm combination, can repeatedly withstand 850 ℃ high temperature impact
☆ Designing thermal expansion coefficient to match materials such as semiconductors and ceramics
High thermal conductivity
☆ Non-magnetic
| Cu/Mo/Cu thickness ratio |
Density g/cm3 |
Coefficient of thermal expansion 10-6/K |
Thermal conductivity TC W/m.Kx-y direction |
Thermal conductivity TC W/m.Kx-z direction |
| 1:1:1 | 9.4 | 9.4 | 300~310 | 240~250 |
| 1:2:1 | 9.6 | 7.7 | 260~270 | 210~220 |
| 1:3:1 | 9.7 | 6.9 | 230~240 | 190~200 |
| 1:4:1 | 9.8 | 6.2 | 210~220 | 170~180 |
| 13:74:13 | 9.9 | 5.8 | 190~200 | 160~170 |
Product Message
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SAF Coolest v1.3 设置面板 RQMSX-ZJFP-IWSDE-ZDW
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