Copper-Molybdenum-Copper (CMC) Series

Product Classification:

Copper-molybdenum-copper (CMC)

Keyword:

AlSiC IGBT substrate AlSiC heat sink


Product Features

Copper-molybdenum-copper is a composite material with a similar "sandwich" structure, the core material is metal Mo, and the two sides are covered with pure copper. Its performance such as expansion coefficient is designable, and it also has the characteristics of high strength, high thermal conductivity and can be punched. Therefore, it is often used in some of the more important occasions, as a heat sink, lead frame and multi-layer printed circuit board (PCB) low expansion and thermal conduction channel.

Product Details


Copper-molybdenum-copper is a composite material with a similar "sandwich" structure, the core material is metal Mo, and the two sides are covered with pure copper. Its performance such as expansion coefficient is designable, and it also has the characteristics of high strength, high thermal conductivity and can be punched. Therefore, it is often used in some of the more important occasions, as a heat sink, lead frame and multi-layer printed circuit board (PCB) low expansion and thermal conduction channel.
Product features:
Can provide large area plate
☆ Can be made into parts, reduce costs
☆ meet with a firm combination, can repeatedly withstand 850 ℃ high temperature impact
☆ Designing thermal expansion coefficient to match materials such as semiconductors and ceramics
High thermal conductivity
☆ Non-magnetic





 

Cu/Mo/Cu
thickness ratio
Density
g/cm3
Coefficient of thermal expansion
10-6/K
Thermal conductivity
TC W/m.Kx-y direction
Thermal conductivity
TC W/m.Kx-z direction
1:1:1 9.4 9.4 300~310 240~250
1:2:1 9.6 7.7 260~270 210~220
1:3:1 9.7 6.9 230~240 190~200
1:4:1 9.8 6.2 210~220 170~180
13:74:13 9.9 5.8 190~200 160~170

 

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