AlSiC Heat Sink
AlSiC IGBT substrate AlSiC heat sink
AlSiC has great potential in military microelectronics and civil microelectronics because of its low thermal expansion, high thermal conductivity, light weight and high stiffness.
AlSiC can be applied to: electronic chip (application specific integrated circuit) and power module heat sink; microprocessor cover and heat sink; computer chip (CPU) and server chip (MPU) cover or bottom heat sink
AlSiC can be applied to: flip-chip cover plate. AlSiC is an ideal material for this application because its CTE can be matched to dielectric substrates, ceramic ball arrays (BGA), low temperature sintered ceramic (LTCC) materials, and printed circuit boards, while also having high thermal conductivity values. In addition, the high strength and hardness of AlSiC also provides protection for integrated circuit devices during assembly. The low density of such materials may also improve the reliability of the device when subjected to shock or vibration.