Products

Structural Component

AlSiC can be used in thermal deformation resistant structural component, wear resistant structural component, lightweight aerospace structural component, ect.

Structural Component

AlSiC can be used in thermal deformation resistant structural component, wear resistant structural component, lightweight aerospace structural component, ect.

Structural Component

AlSiC can be used in thermal deformation resistant structural component, wear resistant structural component, lightweight aerospace structural component, ect.

Structural Component

AlSiC can be used in thermal deformation resistant structural component, wear resistant structural component, lightweight aerospace structural component, ect.

Heat Sink

AlSiC can be used in thermal deformation resistant structural component, wear resistant structural component, lightweight aerospace structural component, ect.

Structural Component

AlSiC can be used in thermal deformation resistant structural component, wear resistant structural component, lightweight aerospace structural component, ect.

Aluminum diamond/copper diamond (Al-Dia/Cu-Dia) series

Diamond copper is a composite material of diamond powder and copper alloy. Using high-quality synthetic diamond powder, which has a thermal conductivity of about 1000 W/M.K, and a very low thermal expansion coefficient, under the appropriate process, diamond particles and copper alloy to reach a metallurgical bonding interface, the diamond copper composite material has excellent thermal conductivity and appropriate thermal expansion coefficient.

Aluminum silicon (AlSi) series

Silicon aluminum (AISi) material is also a metal ceramic composite material, which makes full use of the properties of aluminum and metal silicon, and is mainly used for aerospace packaging tube shell. Although its thermal conductivity is slightly inferior to that of aluminum silicon carbide, its hardness is lower and its machining performance is better than that of aluminum silicon carbide. The silicon content is 27%,42%,50%,60% and 70%. It is mainly used in electronic packaging and plays an excellent role in the packaging of microwave power devices, integrated power modules, T/R modules and other electronic power devices. The use of high-silicon aluminum alloy as the base, shell, box, and cover of the electronic packaging material has high matching, can provide better heat dissipation, can greatly extend the service life of the packaged high-power module, and increase reliability. The material has the characteristics of light weight, high rigidity, high thermal conductivity, low thermal expansion, good mechanical processing and surface coating performance and welding performance, and the material has the characteristics of good compactness, high temperature resistance and corrosion resistance.