Copper/Molybdenum-Copper/Copper (CPC) Series

Similar to copper-molybdenum-copper (CMC), copper/molybdenum-copper/copper (CPC) material is also a sandwich structure. It is wrapped by two sub-layers-copper (Cu) and a core layer-molybdenum-copper alloy (MoCu). It has different thermal expansion coefficients in X region and Y region. Compared with tungsten-copper, molybdenum-copper and copper/molybdenum/copper materials, copper-molybdenum copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price. It was invented by the Japanese at the beginning of this century, should be 3G high-power devices, and is now widely used in high-power chips, device heat dissipation.
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