Copper/Molybdenum-Copper/Copper (CPC) Series

Similar to copper-molybdenum-copper (CMC), copper/molybdenum-copper/copper (CPC) material is also a sandwich structure. It is wrapped by two sub-layers-copper (Cu) and a core layer-molybdenum-copper alloy (MoCu). It has different thermal expansion coefficients in X region and Y region. Compared with tungsten-copper, molybdenum-copper and copper/molybdenum/copper materials, copper-molybdenum copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price. It was invented by the Japanese at the beginning of this century, should be 3G high-power devices, and is now widely used in high-power chips, device heat dissipation.

Copper-Molybdenum-Copper (CMC) Series

Copper-molybdenum-copper is a composite material with a similar "sandwich" structure, the core material is metal Mo, and the two sides are covered with pure copper. Its performance such as expansion coefficient is designable, and it also has the characteristics of high strength, high thermal conductivity and can be punched. Therefore, it is often used in some of the more important occasions, as a heat sink, lead frame and multi-layer printed circuit board (PCB) low expansion and thermal conduction channel.

Molybdenum Copper (Mo-Cu) Series

Molybdenum-copper alloys are used as heat sink materials due to their high thermal conductivity. The properties of these two alloys are close, and the density of molybdenum-copper alloys is less than that of tungsten-copper alloys. The preparation of molybdenum copper alloy is mainly by melting and leaching method, using high quality molybdenum powder and oxygen-free copper powder, and applying isostatic pressing (high temperature sintering-copper infiltration), with fine organization, good arc breaking performance, good electrical conductivity, good thermal conductivity and small thermal expansion. Japan's Tokyo Tungsten Company to obtain the molybdenum copper alloy production patent, the use of chemical activation sintering method.

Tungsten Copper (W-Cu) Series

Tungsten copper material combines the advantages of metal tungsten and copper, of which tungsten has high melting point (tungsten melting point is 3410 ℃, copper melting point is 1080 ℃) and high density (tungsten density is 19.25g/cm3, copper density is 8.92g/cm3); Copper has excellent electrical and thermal conductivity, tungsten copper alloy (the general composition range is WCu7 ~ WCu50) has uniform microstructure, high temperature resistance, high strength, arc ablation resistance, and high density; moderate electrical and thermal conductivity, and is widely used in military high-temperature resistant materials, high-voltage switch electrical alloys, Electro-machining electrodes, microelectronic materials, as parts and components are widely used in aerospace, aviation, electronics, electric power, metallurgy, machinery, sports equipment and other industries.

Copper (Cu) Series

Oxygen-free copper is pure copper that does not contain oxygen or any deoxidizer residue, without hydrogen embrittlement. It has a density of 8.9(g/cm3), a melting point of 1083°C, a softening temperature of 150°C, a thermal conductivity of 391W/(M.K), and a thermal expansion system of 17.7(10-6/K). Oxygen-free copper has good thermal conductivity, good processing performance, welding performance, corrosion resistance and low temperature performance. Widely used in the electronics industry. The surface of the product can be nickel-plated, gold-plated, silver-plated and other treatments.

Heat sink

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.

Structural Component

AlSiC can be used in thermal deformation resistant structural component, wear resistant structural component, lightweight aerospace structural component, ect.

Heat sink

AlSiC has great potential in military and civil microelectronics applications due to its low thermal expansion, high thermal conductivity, light weight and high stiffness.